Semiconductor

NEW

Contribution to Next Generation Technology
(SEMICONDUCTOR Miniaturization to 22nm/18nm)

N2 purge application
300mm FOUP Load Port
(SELOP12F25-S7-N Series)

Prevent cross contamination and surface oxidation

Quickly control wafer in FOUP through Loadport N2 purge function

features

Superior Stable Placement by Original movable nozzle Patent pending

Control nozzle upward timing
Interference avoidance of Kinematic Pin at FOUP placement
Compatibility of non-N2 purge Applicable FOUP
Adjustment function of nozzle pressure
Nozzle up and down position checking function (Sensor)
Exchangeable nozzle heads for Suitable attach to ports

1.N2 purging on Carrier Base

  • Adapted FOUP Type: ENTEGRIS A-300, Spectra
    (4 Purge Port Type)

2.Monitoring N2 Gas flow rate by flow meter

3.Preventing contamination through purge port

  • (1)GAS-Filter at INLET Port side
  • (2)Adhesion to Grommet of FOUP-side