RFID Inlay : Utilizing our high speed bonding machine that realizes the fastest class in the world of 30,000UPH, a large volume of RFID inlay can be supplied with reasonably inexpensive price.

Inlay product line-up

  • We contract manufacture RFID inlay upon your request.
  • Bonding your specified IC chips is also available.
    (Feel free to ask us just for only a small volume.)
    • - Film base material : Paper, PET
    • - Electric conductive material : Silver paste, Aluminum, Copper etc
    • - Frequency : UHF/HF/Microwave etc
  • Special tag processing such as metalworking and waterproof are also available.
    Feel free to ask us about special processing.

Features of our bonding machine

Our bonding machine is the world fastest class by bonding chips directly onto the film substrates.
Mass production with inexpensive cost is possible.

Bonding part / Cure part / Checking part

Major specification of bonding machine

Manufacturing method Roll to Roll manufacturing method
Processing capability Maximum 30,000pieces/hour
Bonding method NCP, ACP

Available inlay

Standard type

Models INR-B1P-017 INR-B1P-018 INR-B1P-019 INR-B1P-020
Shape & Dimension        
Design Button Paper clip Satellite Propeller
  Button Paper clip Satellite Propeller
  Enlarge Enlarge Enlarge Enlarge
Antenna dimension Ø11mm 8x17mm 32x18mm 94x8mm
Chip specification  
Mounted chip Impinj Monza2
Protocol EPC global Class1 Gen 2 (ISO18000-6 Type C)
Frequency 860 - 960MHz
Memory capacity EPC : 96bit
Antenna specification  
Material Silver paste (5um) + PET (50um)
Manufacturing method Roll screen printing
Adhesive NCP
Packaging condition        
Width of base material 50mm 50mm 50mm 120mm
Core inner diameter 3inch 3inch 3inch 3inch
Antenna pitch 22mm 27mm 30mm 30mm
Reference of Communication distance *1 9cm 9cm 1.2m 4.2m

*1 : Circular polarized wave antenna is used in indoor environment.
Communication distance may change depends on environmental condition (such as degree of moisture, performance of reader writer, and whether there is metal or not.)

Inlay product availability

Category Specification
Chip specification 0.7mm square∼1.2mm square
  • Any IC chips can be adapted by arranging specified parts feeders. (Impinj, NXP, Alien etc)
  • 0.4mm square chip process (NXP G2XL/M) is under development.
  • IC chips corresponding to Monza3,4 are going to be available in this summer.
Antenna specification Design Optional
  Dimension Width of base material. Antenna pitch. Single line role.
  Circuit material Silver paste, Aluminum, Copper, etc *1
  Film material PET, Paper
  Manufacturing method Screen printing, Etching, Vapor deposition
Adhesive NCP, ACP (viscosity : less than 30Pa⋅s)

*1 : Corresponded manufacturing method and circuit material

Manufacturing method / Circuit material Silver paste Aluminum Copper
Screen printing - -
Etching -
Vapor deposition - -

Reliability test

Category Major test result

Damp Heat (Storage) test

<Test condition>
85°C 85%RH
1000 hours
Damp Heat (Storage) test

Thermal cycle test

<Test condition>
-25°C to 85°C 20 cycle
every 30 minutes
Thermal cycle test

Bending test

<Test condition>
R10mm applying 7.5N tension
bending, 400 times
Bending test

*The above-mentioned test results are reference only and they are not represented as 100% guarantee on the performance of products.

Inquiry

RFID inlay sales and marketing
TEL : +81-3-5473-1826

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