• •We contract manufacture RFID inlay upon your request.
• •Bonding your specified IC chips is also available.
  (Feel free to ask us just for only a small volume.)
  • - Film base material : Paper, PET
  • - Electric conductive material : Silver paste, Aluminum, Copper etc
  • - Frequency : UHF/HF/Microwave etc
• •Special tag processing such as metalworking and waterproof are also available.
  Feel free to ask us about special processing.

Our bonding machine is the world fastest class by bonding chips directly onto the film substrates.
Mass production with inexpensive cost is possible.

Manufacturing method	Roll to Roll manufacturing method
Processing capability	Maximum 30,000pieces/hour
Bonding method	NCP, ACP

Models	INR-B1P-017	INR-B1P-018	INR-B1P-019	INR-B1P-020
Shape & Dimension
Design	Button	Paper clip	Satellite	Propeller
	Enlarge	Enlarge	Enlarge	Enlarge
Antenna dimension	Ø11mm	8x17mm	32x18mm	94x8mm

Chip specification
Mounted chip	Impinj Monza2
Protocol	EPC global Class1 Gen 2 (ISO18000-6 Type C)
Frequency	860 - 960MHz
Memory capacity	EPC : 96bit
Antenna specification
Material	Silver paste (5um) + PET (50um)
Manufacturing method	Roll screen printing
Adhesive	NCP
Packaging condition
Width of base material	50mm	50mm	50mm	120mm
Core inner diameter	3inch	3inch	3inch	3inch
Antenna pitch	22mm	27mm	30mm	30mm
Reference of Communication distance *1	9cm	9cm	1.2m	4.2m

*1 : Circular polarized wave antenna is used in indoor environment.
Communication distance may change depends on environmental condition (such as degree of moisture, performance of reader writer, and whether there is metal or not.)

Category		Specification
Chip specification		0.7mm square∼1.2mm square ∗Any IC chips can be adapted by arranging specified parts feeders. (Impinj, NXP, Alien etc) ∗0.4mm square chip process (NXP G2XL/M) is under development. ∗IC chips corresponding to Monza3,4 are going to be available in this summer.
Antenna specification	Design	Optional
	Dimension	Width of base material. Antenna pitch. Single line role.
	Circuit material	Silver paste, Aluminum, Copper, etc *1
	Film material	PET, Paper
	Manufacturing method	Screen printing, Etching, Vapor deposition
Adhesive		NCP, ACP (viscosity : less than 30Pa⋅s)

*1 : Corresponded manufacturing method and circuit material

Manufacturing method / Circuit material	Silver paste	Aluminum	Copper
Screen printing	✓	-	-
Etching	-	✓	✓
Vapor deposition	-	✓	-

Category	Major test result
Damp Heat (Storage) test <Test condition> 85°C 85%RH 1000 hours
Thermal cycle test <Test condition> -25°C to 85°C 20 cycle every 30 minutes
Bending test <Test condition> R10mm applying 7.5N tension bending, 400 times

*The above-mentioned test results are reference only and they are not represented as 100% guarantee on the performance of products.