• •We contract manufacture RFID inlay upon your request.
• •Bonding your specified IC chips is also available.
  (Feel free to ask us just for only a small volume.)
  • - Film base material : Paper, PET
  • - Electric conductive material : Silver paste, Aluminum, Copper etc
  • - Frequency : UHF/HF/Microwave etc
• •Special tag processing such as metalworking and waterproof are also available.
  Feel free to ask us about special processing.

• ⋅RFID Inlets that used our originally manufactured antenna.
• ⋅Corresponding with small amount of order, short delivery time, and reducing initial cost.

Models	Design	Antenna dimension [mm]	Mounted chip	EPC Memory [bit]	User Memory [bit]	Catalog
INR-X2E	Enlarge	95 x 18	impinj monza3	96	-	[INR-X2E]
INR-031	Enlarge	68 x 14	impinj monza5	96	-	[INR-031]
INR-032	Enlarge	44 x 18				[INR-032]
	Enlarge	8 x 95	impinj monza4	96	*
	Enlarge	30 x 47
	Enlarge	19 x 68

• ⋅Bonding designated RFID inlay by using from film material, chip to antenna.
• ⋅Specifications of bonding chips is listed below.

Category		Specification
Specifications of chips		Corresponding to IC chips such as impinj, NXP, Alien, and more.
Antenna specification	Design	Optional
	Dimension	Width of base material. Antenna pitch. Single line role.
	Circuit material	Silver paste, Aluminum, Copper, etc *1
	Film material	PET, Paper
	Manufacturing method	Screen printing, Etching, Vapor deposition
Adhesive		ACP (viscosity : less than 30Pa⋅s)

*1 : Corresponded manufacturing method and circuit material

Manufacturing method / Circuit material	Silver paste	Aluminum	Copper
Screen printing	✓	-	-
Etching	-	✓	✓
Vapor deposition	-	✓	-

• ⋅Our bonding machine is the world fastest class by bonding chips directly onto the film substrates.
  Mass production with inexpensive cost is possible.

Manufacturing method	Roll to Roll manufacturing method
Processing capability	Maximum 30,000pieces/hour
Bonding method	ACP

• ⋅Providing uniform quality of reliable RFID inlay with highly precise bonding and special cure method.

Category	Major test result
Damp Heat (Storage) test <Test condition> 85°C 85%RH 1000 hours
Thermal cycle test <Test condition> -25°C to 85°C 20 cycle every 30 minutes
Bending test <Test condition> R10mm applying 7.5N tension bending, 400 times