


| Models | Design | Antenna dimension [mm] |
Mounted chip | EPC Memory [bit] |
User Memory [bit] |
Catalog |
|---|---|---|---|---|---|---|
| INR-X2E | 95 x 18 | impinj monza3 |
96 | - | ||
| INR-031 | 68 x 14 | impinj monza5 |
96 | - | ||
| INR-032 | 44 x 18 | |||||
| 8 x 95 | impinj monza4 |
96 | * | |||
Enlarge |
30 x 47 | |||||
| 19 x 68 |
| Models | User Memory [bit] |
|---|---|
| Monza4 QT | 512 |
| Monza4 E | 128 |
| Monza4 D | 32 |
| Category | Specification | |
|---|---|---|
| Specifications of chips | Corresponding to IC chips such as impinj, NXP, Alien, and more. | |
| Antenna specification | Design | Optional |
| Dimension | Width of base material. Antenna pitch. Single line role. | |
| Circuit material | Silver paste, Aluminum, Copper, etc *1 | |
| Film material | PET, Paper | |
| Manufacturing method | Screen printing, Etching, Vapor deposition | |
| Adhesive | ACP (viscosity : less than 30Pa⋅s) | |
*1 : Corresponded manufacturing method and circuit material
| Manufacturing method / Circuit material | Silver paste | Aluminum | Copper |
|---|---|---|---|
| Screen printing | ✓ | - | - |
| Etching | - | ✓ | ✓ |
| Vapor deposition | - | ✓ | - |
| Manufacturing method | Roll to Roll manufacturing method |
|---|---|
| Processing capability | Maximum 30,000pieces/hour |
| Bonding method | ACP |
| Category | Major test result |
|---|---|
Damp Heat (Storage) test <Test condition>85°C 85%RH 1000 hours |
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Thermal cycle test <Test condition>-25°C to 85°C 20 cycle every 30 minutes |
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Bending test <Test condition>R10mm applying 7.5N tension bending, 400 times |
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